Overbond Launches the First End-to-End Platform for Primary Bond Origination

TORONTO — June 29, 2016 — Overbond Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market….

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Overbond Secures $7.5M in Seed Financing

Injection of Capital Positions Overbond to Transform Investment Banking and Bond Issuance Market. TORONTO — June 16, 2016 — Overbond Ltd., the first fintech platform for digital bond issuance, has closed a $7.5-million seed financing round with Morrison Financial Services Limited. The deal marks a significant step forward for the company as the first fintech…

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