Buy-side fights back against primary market pressure

Source: The Desk As new platforms promise to increase efficiency in bond issuance, buy-side firms are looking for leverage to drive change, and not only through technology. The US debt markets had issued US$1.92 trillion of bonds by September 2020, with US$1.4 trillion raised in the first half alone, according to Refinitiv data. That peaked…

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Bond Buyer Matching AI

Over the past two years, we have witnessed profound changes in the fixed income marketplace with counterparties increasingly adopting quantitative investing and liquidity risk monitoring techniques. These include adoption of new methods of analysis such as AI analytics like COBI-Matching algorithm. Source: Overbond Fixed Income Artificial Intelligence The financial services market is embracing digital processes…

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Meet the Technology Companies Automating Capital Markets

In an effort to cut costs and make internal processes more interesting, U.S. investment banks are busy trying to automate the process of doing deals. Source: efinancialcareers First they came for the equities traders and the FX traders. Then they came for the CDS index traders. Now, it seems, the computers are changing the jobs of people working in M&A…

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Treasury Today Feature on Overbond and Bond Market Evolution

Treasury Today talks to Vuk Magdelinic on founding Overbond and how the company plans to revolutionize the primary bond issuance process Source: Treasury Today In the second instalment of Treasury Today’s Fintech Focus series, the company takes a look at Canadian start-up, Overbond. Overbond’s CEO, Vuk Magdelinic, explains how the company looks to revolutionise the primary…

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Overbond Digitizes Deal Execution for the World’s Primary Bond Issuance Market with the Launch of OverbondX

“All to all” information flows underpin newly launched Overbond deal execution capability; OverbondX enables corporate and government bond issuers, dealers, and investors to now facilitate all aspects of deal execution from within the Overbond platform TORONTO and NEW YORK — January 25, 2017 — Overbond Ltd., the company behind the first end-to-end platform for bond…

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