Overbond Launches the First End-to-End Platform for Primary Bond Origination

TORONTO — June 29, 2016 — Overbond Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market….

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‘Spring Cleaning’ in the Credit Markets

Rating agencies downgrade companies from one category to another adding to volatility in trading levels. Source: Wall Street Journal Rating agency downgrades are helping shift the pricing dynamics across the U.S. corporate bond market. As credit raters drop their outlooks across the sector, the amount of additional yield that investors demand over super-safe Treasurys is rising…

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