Overbond Launches the First End-to-End Platform for Primary Bond Origination
TORONTO — June 29, 2016 — Overbond Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market….