Overbond Launches the First End-to-End Platform for Primary Bond Origination

TORONTO — June 29, 2016 — Overbond Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market….

Read More

New Fintech Platform Overbond Aims to Disrupt ‘Opaque’ Bond Market

Overbond co-founders Han Ryoo and Vuk Magdelinic in Toronto Source: The Globe and Mail Financial technology is changing how people borrow, save and invest, and is now infiltrating one of the stodgiest areas of financial services: the fixed-income market. Overbond is a relatively new Toronto-based fintech with a cloud-based pricing communication platform that automates tasks for…

Read More