Overbond Launches the First End-to-End Platform for Primary Bond Origination

TORONTO — June 29, 2016 — Overbond Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market….

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Debt and Tech: Who Knew?

Behind the spotlight, debt financing remains a significant driver of technology transactions Last week, Microsoft acquired LinkedIn, the social media platform geared towards professional networks. The acquisition was impressive on its own, but even more so for the price: Microsoft spent a whopping $26.2 billion on the purchase. One of the aspects that has been…

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Overbond Secures $7.5M in Seed Financing

Injection of Capital Positions Overbond to Transform Investment Banking and Bond Issuance Market. TORONTO — June 16, 2016 — Overbond Ltd., the first fintech platform for digital bond issuance, has closed a $7.5-million seed financing round with Morrison Financial Services Limited. The deal marks a significant step forward for the company as the first fintech…

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New Fintech Platform Overbond Aims to Disrupt ‘Opaque’ Bond Market

Overbond co-founders Han Ryoo and Vuk Magdelinic in Toronto Source: The Globe and Mail Financial technology is changing how people borrow, save and invest, and is now infiltrating one of the stodgiest areas of financial services: the fixed-income market. Overbond is a relatively new Toronto-based fintech with a cloud-based pricing communication platform that automates tasks for…

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